US Series Lead-free Wave Soldering System

HeChuan Intelligent Electronics Co.,Ltd

US Series Lead-free Wave Soldering System

  • Precision Nozzle Movement:
  • Dual-axis nozzle with stepping motor for accurate positioning and flexible spraying.
  • Modular Preheating:
  • Hot air and infrared heating can be combined for efficient preheating of PCBs.
  • Innovative Solder Pot:
  • Adjustable wave drop reduces tin dross and improves quality.
  • High-Capacity Transport System:
  • Guide rail supports up to 60KG with stable transport.
  • Efficient Cooling:
  • Dual blowing structure allows adjustable cooling efficiency.

US Series Lead-free Wave Soldering System

Advanced Soldering and Preheating Solutions

1.   Precision Dual-Axis Nozzle Movement:

         The nozzle system features dual-axis linkage in the X and Y directions, driven by a stepping motor for precise positioning. The flexible programming control allows for complex processes,  including partial secondary spraying and continuous spraying in specific areas, to meet varied manufacturing requirements.

2.   Modular Preheating Flexibility (3-Stage Preheating):

         The preheating modules offer a free combination of hot air and infrared heating. This flexibility allows for optimal preheating of PCB products, accommodating different process requirements and enhancing preheating efficiency and effectiveness.

3.   Innovative Solder Pot and Crest Nozzle Design:

         The newly designed solder pot features an adjustable tin wave drop, which significantly reduces the generation of tin dross, improving both material efficiency and product quality.

4.  High-Capacity Rail Transport System:

         The guide rail system boasts a maximum transport capacity of 60KG, thanks to an innovative transportation chain assembly structure and support method. This ensures a more stable   transport speed and higher carrying capacity for heavier components.

5.  Efficient Cooling System Design:

          The cooling system is designed with an upper and lower blowing structure, allowing for flexible control of cooling efficiency to meet specific production needs.

MODEL

US-350

GENERAL

Wave   Soldering Outside Dimension(L*W*H)

4350×1600×1730mm

Power   Supply

3P5W   380V AC 50/60Hz 100A

Option:3P5W   220V AC 50/60Hz 150A

Power   demand

80KW     (Total Power * 1.2 Safety Factor) Hot   Air

Electrical   Control

Total   power

45KW  (+6KW/PCS For Each   Additional Preheating Module)

Operating   power

≤9KW

Control   mode

PC+PLC

Preheating   System

Preheat   mode

Hot   Air

IR

Speed   regulation mode

Stepless   Frequency Control

N/A

Preheat   zones number

3

Option:   Upper preheating(MAX 3PCS)

Preheat   zone length

1800mm(2480mm   optional 4 preheat)

Preheat   temperature

Room   Temperature ~250℃

Welding   System

Working   mode of tin furnace

Mechanical   Pump

Power   of heating tube of tin furnace

14.5KW

Tin   furnace capacity

Lead-free: About 480KG

MAX   temp of tin furnace

MAX:   300℃

Temp.   control method

PID+SSR

Wave   driving power

1/4 HP×2  3P 220VAC

Warming   up time

About   180 min(Set:250℃)

PCB   Transport System

Width   range of PCB

50-350mm

PCB   board component height

Top   90mm,Bottom 25mm

PCB   transmission speed

300~1800mm/min

PCB   inlet transport height

750±20mm

Option:   Booster Pad 100mm 150mm
  200mm 250mm

Transport   guide rail inclination

Factory:5.5°±0.2°(4°— 7°Adjustable)

Transmission   motor power

90W  3P 220VAC

N2   System (Option)

nitrogen   consumption

25m³/h  below 1000ppm

pressure   nitrogen source

0.5~0.8MPa

Others

Flux   Automatic Addition

Equipped   with corrosion-resistant air-operated diaphragm pump

Spray   Flow

20~100ml/min

Exhaust   pipe dimeter

Φ200mm

Air   cooler

Option

2HP


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