GXS Series of Wave Soldering Machine
Design & Efficiency: The equipment utilizes a U-shaped heater designed for hot air preheating. It promises a long service life, which helps to minimize maintenance downtime.
Energy Efficiency: The heater has internal reinforcement insulation, with an optional external protection device, which significantly reduces heat loss, making the system up to 20% more energy-efficient compared to traditional equipment.
Work Environment: The equipment's low surface temperature improves the working environment by reducing excess heat.
Integration & Safety: This system integrates the advantages of both internal and independent spray mechanisms without increasing costs. It is positioned away from the preheating zone, ensuring safety and cleanliness.
Durability: The system features a heavy-duty titanium alloy claw for transportation, with a sectional guide rail design supported by a stainless steel strip, enhancing durability.
Solder Pot: The solder pot is made from special materials with an anti-corrosion coating, ensuring a longer life span.
Efficiency: The spray fluxer uses imported precision nozzles for uniform atomization, improving efficiency.
Maintenance Efficiency: The nozzle can be quickly released, reducing maintenance time from hours to minutes. The mesh grid design minimizes blockages caused by solder dross, extending the maintenance interval from monthly to every six months.
Optional Features: An optional solder supply device helps maintain consistent wave height by compensating for changes in solder levels.
Model No. | 350 Series |
GXS-350-M | |
Dimension(L×W×H)mm | 3885*1655*1710 |
Spray Fluver Dimension (L*W*H)mm | 1300*1350*1595mm |
Power Supply | AC 380V 3Φ5W 50/60Hz (Option:AC220V3P50/60Hz) |
Initial/Operating Power | 80KW/8KW |
Starting power | 37KW |
Air Source | 0.5-0.8Mpa |
Control System | PC+PLC |
Flux Flow | 10〜100ml/min |
Exhaust Tube Diameter | Φ 200 mm |
Exhaust Mode | Upward |
Preheat Mode | IR / Hot Air |
Preheat Zone Number | 3 zones/1800mm |
Preheat Temp. Range | Room Temp.〜230℃ |
Temp. Control Mode | PID+SSR |
Solder Pot Type | Mechanical Pump |
Pot Capacity | Approx. 480kg |
Max. Soldering Temp | MAX :300 ℃ |
Wave Driving Power | 1/4 HP X2 |
Wave Height Control | Inverter |
Heat Up Time | Approx .150min (Setting: 250℃) |
PCB Conveying Speed | 300〜1800mm/min |
The Width Of PCB | 50-350mm |
Component Height | Top:120mm Bottom: 25mm |
Transport Height | 750±20mm (Entrance) |
Conveyor Angle | 4〜7° Adjustable |
Speed Control Mode | Inverter |
Cooling Method | Forced Air Cooling (Opiton: chiller) |
N2 System | SMART-350-M-N |
Nitrogen Consumption | 15m³/h Below 1000ppm |
Pressure Nitrogen Source | 0.5〜0.8Mpa |
Oxygen Nitrogen Source | ≤10PPM |
Oxygen Analyzer | Option |
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