The New Neneration High Speed Pick And Place Machine

The New Neneration High Speed Pick And Place Machine

1. 120,000 CPH (Optimum)
2. Ultra-compact design with a width of 1.25 meters
3. Equipped with a high-speed modular rotary head
4. Monitoring before and after component placement
5. Mixed production of different types, independent production on front and rear,non-stop component changeover
6. High-speed,high-precision feeder
7. SMART Feeder with the industry's first automatic component loading and automatic feeding
8. loading and automatic feeding

Description

The New Neneration High Speed Pick And Place Machine

EXCEN is a high-speed modular pick-and-place machine equipped with 16 nozzles and a rotary head, designed for efficient component placement. It achieves a high speed of 120,000 components per hour (CPH) in specific product areas and significantly enhances the utilization of production area efficiency. EXCEN is equipped with monitoring functions before and after component placement, ensuring the reliability of small component placement. The machine supports various operating modes, including non-stop component changeover and mixed production of different boards. Additionally, EXCEN is equipped with a SMART Feeder, enabling automatic component supply and feeding, further improving operational convenience and actual production efficiency.

Features:

1. 120,000 CPH (Optimum)

2. Ultra-compact design with a width of 1.25 meters

3. Equipped with a high-speed modular rotary head

4. Monitoring before and after component placement

5. Mixed production of different types, independent production on front and rear,non-stop component changeover

6. High-speed,high-precision feeder

7. SMART Feeder with the industry's first automatic component loading and automatic feeding

8. loading and automatic feeding

Model name			Excen
Mounting head			High speed mounting head	Universal mounting head
Number of shafts			17 shaft x 4 cantilever	8 shafts and 4 cantilevers
Installation speed			120000CPH (optimal condition)	76000CPH (optimal condition)
Mounting accuracy	Chip/QFP		±50μm@u+3a/Chip,±50um@u+3a/QFP (Based on the Standard Chips)
Component size			Chip 0402-mouth 8mm (H 3mm)	Chip 0402-18mm (H 8mm) IC,Connector(Lead Pitch 0.5mm) BGA,CSP(Ball Pitch 0.3mm)
Substrate size (mm)	Dual track	minimum	50(L)x50(W)
		maximum	330(L)x 250(W)
	PCB thickness		0.3-4.0
Number of Feeders (8mm benchmark)			120ea(Docking Cart)
Utilty	Power Supply		AC200/208/220/240380V415V(50V60Hz,3Phase] Max. 4.5kVA
	Air peesune		0.5-0.7MPa(5-7kgf/cm21100N/min
wa igiht			Approx.2.1 50kg
Equipment size (mm)			1,250(L)x2, 420(D)x 1,430(H)
size