The MEKA-S3 is an advanced 3D solder paste automatic optical inspection machine (3D SPI), designed to meet the high precision and reliability demands of the electronics manufacturing industry. Key features include a self-developed light board control system that enables precise and stable imaging, equipped with a four-segment LED light source with 3000 levels of precise light control.
The 3D algorithm of this device is optimized for different panel colors, providing highly stable inspection performance with white light projection that adapts to panels of various colors. The MEKA-S3 offers multiple levels of inspection accuracy, capable of achieving 10-micron and 15-micron SPI measurements, suitable for high-precision measurement of small components ranging from 01005 to 0201 chips. Additionally, the device is equipped with a high-speed conveyor system, ensuring efficient inspection performance in fast-paced production lines.
Furthermore, the MEKA-S3 features a user-friendly software interface that supports various analysis modes and is compatible with different PCB sizes, providing users with greater flexibility and practicality.
Equipment details
Software
Camera
The self-developed head control driver card provides efficient and stable imaging, with a four-segment SMD LED light source and 3000-level precise light control.
The 3D solution algorithm is optimized for the scene, uses white light projection, is compatible with panels of different colors, and has high solution stability.
Dimensions
Model | MEKA-S3 | |
Maximum PCB Size Range | ||
In-line SPI | 50×50~510×460mm | |
Detection capability | ||
10um | 01005 Chip(inch) | |
15um | 0201Chip(inch) | |
3D Detection Technology | ||
DLP | Standard configuration | One-way moiré projection |
Optional | Bidirectional moiré projection | |
Solder paste height | maximum | 400um |
smallest | 40um | |
High accuracy | ±1um | |
Fastest detection speed | ||
5MP camera | 15um | 2,700mm²/Sec |
12MP camera | 10um | 2,700mm2/Sec |
15um | 6,000mm2/5ec | |
System specifications | ||
PCB front clearance | 30mm | |
PCB bottom clearance | 40mm | |
PCB maximum weight | 4KG | |
PCB thickness | 0.5~6mm | |
System functions | Standard configuration | Built-in SPC, no GERBER programming, built-in review software, printing press feedback |
Optional | Code reader, maintenance station computer, offline programming system, MES docking, SPC+ | |
Power system | X/Y | Servo power system |
Power requirements | Single phase 200~240V50~60Hz, 1.1kw | |
air pressure | 5Kgf/cm2(0.5 MPa),5LPM | |
size and perspective | ||
Dimensions(mm) | Machine | 1,038(W)x1,359(D)x1,607(H) |
Width (Machine & Conveyor) | 1,060 | |
weight | 850KG | |
Delivery is prompt!
By 10-year industry experts!
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Unbeatable cost performance!
