HeChuan Intelligent Electronics Co.,Ltd

MEKA-S3 Plus

  • AI Autonomous Programming Detection Device
  • High-precision laser marking and inspection system
  • Bidirectional moiré pattern projection technology
  • 10 GigE camera
  • DLP 3D imaging technology
  • Maximum supported PCB size: 50x50 – 510x460mm
  • Compatible PCB thickness: 0.5-6mm
  • Inspection accuracy: ±1um
  • Built-in SPC, soldering defect and crack detection

The MEKA-S3 PLUS is a high-precision laser marking and inspection system designed for the demanding requirements of fine circuit board inspection. It features bidirectional moiré pattern projection technology and is equipped with a 10 GigE camera, ensuring high accuracy and efficiency in inspection. The DLP 3D imaging technology of the MEKA-S3 PLUS provides stable and precise 3D inspection capabilities, making it especially suitable for inspecting high-precision circuit boards.

The device supports a maximum PCB size of 50x50 – 510x460mm and is compatible with PCB thicknesses ranging from 0.5 to 6mm, with inspection accuracy reaching ±1um. The system includes SPC (Statistical Process Control), non-substrate and soldering defect detection, crack defect detection, and various other intelligent functions, meeting the quality control requirements of modern production.


Camera

MEKA-S3 PlusMEKA-S3 Plus

Equipped with bidirectional moiré pattern projection, a 10 GigE camera, ensuring high precision and efficiency.

Higher pixel density leads to more detailed inspection quality, standard dual HD DLP provides stable and precise 3D performance, ideal for precision circuit boards.


Software

MEKA-S3 Plus


Equipment details

MEKA-S3 Plus


Dimensions

MEKA-S3 Plus


Model

MEKA-S3 Plus

MEKA-S3D Plus

Maximum PCB Size Range

In-line SPI

50×50~510×460mm

50×50~510×580mm(Dual)
  50×50~510    x320mm(Single)

Detection capability 

10um

01005 Chip(inch)

15um

0201Chip(inch)

3D Detection Technology

DLP

Bidirectional moiré projection

Solder paste height

maximum

400um

smallest

40um

High accuracy

±1um

Fastest detection speed

16MP camera

10um

3,200mm²/Sec

System specifications



PCB front clearance

60mm

PCB bottom clearance

80mm

PCB maximum weight

4KG

PCB thickness

0.5~6mm

System functions

Standard configuration

Built-in SPC, no GERBER programming, built-in review software, printing   press feedback

Optional

Code reader, maintenance station computer, offline programming system,   MES docking, SPC+

Power system

Single phase 200~240V50~60Hz, 1.1kw

air pressure

5Kgf/cm2(0.5 MPa),5LPM

size and perspective

Dimensions(mm)

Machine

1,038(W)x1,359(D)x1,607(H)

Width (Machine & Conveyor)

1060

weight

850KG


Inventory is abundant.

Delivery is prompt!

Professional consultation offered.

By 10-year industry experts!

Credit is guaranteed.

Diverse payment methods available!

100% repeat purchase.

Unbeatable cost performance!

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