MEKA-M3/M3D 3D AOI Automated Optical Inspection Systems
Multi-directional projection shadow elimination technology
• Multi-angle projection to minimize shadow interference and ensure accurate 3D imaging
• Completely self-developed DLP control card ensures test stability
• Accurate self-developed 3D algorithm, high-precision detection, up to 30mm components can be measured
Real 3D comprehensive inspection
• Multi-frequency stripe technology ensures stable and accurate measurement from small components to large components
• Self-developed point cloud processing technology to achieve noise-free, high-definition imaging
• 3D inspection covers all components and processes huge amounts of data at high speed
Intelligent programming of component library
• Component library push mechanism realizes intelligent and efficient programming and significantly improves programming speed
• Component library matching technology, enter the component library matching based on the material appearance, find the highest similarity components to pull and use, and quickly program with one click
Stable software architecture and high-precision algorithms
• High-precision structured light 3D reconstruction algorithm, stable and efficient
• Machine vision system that integrates traditional visual inspection algorithms and AI deep learning algorithms
• Graphical interaction method, which can formulate algorithm processes for different products, simple and easy to use
SPC system
• The software can display 2D and 3D textures to help users intuitively and accurately read product process characteristics
• Defect statistical analysis to help fundamentally solve process defects
• Three-point imaging, multi-station traceability analysis of line body process
One person, multiple machines
• One-person multi-machine system reuses re-judgment personnel to reduce redundancy and maximize the efficiency of re-judgment personnel
• Improve equipment utilization, enhance the flexibility of re-judgment, and promote the skill improvement of re-judgment personnel
| model | MEKA-M3/M3D | |
| imaging system | camera | 25MP |
| 3D projection head | four projections | |
| lighting system | RGBW+coaxial | |
| imaging technology | Pixel resolution | 10um |
| Detect smallest components | 01005 CHIP | |
| FOV | 51×51mm | |
| Acquisition speed | 0.7s/Fov | |
| High accuracy | ±3um | |
| Highest 3D imaging | 15mm (optional 30mm) | |
| 2D inspection items Missing parts | offset, rotation, flipped parts, 0CR, wrong parts, polarity, false soldering, tin connection, glue overflow | |
| 3D inspection items Missing parts | offset, skewed, floating, lifted legs, tin climbing, monument erection, flying parts, multiple parts | |
| S2 measure board size | 50×50-510×460mm | |
| S2D measure board size | 50×50-510×320mm | |
| Board transfer height | 880-920mm | |
| Circuit board front height | 35mm | |
| Circuit board reverse height | 40mm | |
| Measurable thickness of circuit board | 0.5-5mm | |
| Maximum weight of circuit board | 3KG | |
| software | Detection software、RS、SPC | |
| M3 computer system | UPS + PC（ i7-14700K、128GB RAM 1TB SSD+4TB HDD） | |
| M3D computer system | UPS + PC（ i7-14700K、128GB RAM 1TB SSD+8TB HDD） | |
| Optional accessories | External barcode reader, maintenance workstation (PC) | |
| X/Y axis | Servo motor system | |
| Power requirements | Single phase 200-240V, 50-60Hz | |
| size | 1024(W) ×1230(D) ×1612（H）mm | |
| weight | About900KG | |
Delivery is prompt!
By 10-year industry experts!
Diverse payment methods available!
Unbeatable cost performance!
